Apparatus and method for treating substrate

ABSTRACT

Disclosed is a method for liquid-treating a substrate. In a method for treating a substrate, the substrate may be treated by supplying a treatment liquid onto the rotating substrate by using a first nozzle and a second nozzle, the first nozzle supplies the treatment liquid to an area including a central area on the substrate, and the second nozzle supplies the treatment liquid to a peripheral area of the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

A claim for priority under 35 U.S.C. §119 is made to Korean PatentApplication No. 10-2016-0065859 filed May 27, 2016, in the KoreanIntellectual Property Office, the entire contents of which are herebyincorporated by reference.

BACKGROUND

The inventive concept relates to an apparatus and a method for treatinga substrate.

Contaminants such as particles, organic contaminants, and metalliccontaminants on a surface of a substrate greatly influence thecharacteristics and yield rate of a semiconductor device. Due to this, acleaning process of removing various contaminants attached to a surfaceof a substrate is very important, and a process of cleaning a substrateis performed before and after unit processes for manufacturing asemiconductor. In general, a process of cleaning a substrate includes achemical treating process of removing metallic substances, organicsubstances, and particles residing on a substrate by using a treatmentliquid such as a chemical, a rinsing process of removing the chemicalresiding on the substrate by using pure water, and a drying process ofdrying the substrate by using an organic solvent, a supercritical fluid,or a nitrogen gas.

FIG. 1 is a view illustrating a supporting unit that supports asubstrate and a liquid supply unit that supplies a liquid of a generalsubstrate treating apparatus. FIG. 2 is a view illustrating thesubstrate of FIG. 1, to which the liquid is supplied, when viewed fromthe top. Referring to FIGS. 1 and 2, in general, when an organic solvent32 is supplied onto the substrate 31 to dry the substrate, the liquidsupply unit 33 discharges the organic solvent 32 to the substrate 31supported by the substrate support unit 34 while the substrate 31 isrotated. In this case, fingerings are caused by a centrifugal force ofthe substrate 31 in a process in which the organic solvent 32 is appliedto the whole substrate 31. As a time period until the organic solvent 32is applied becomes longer, areas between the fingerings 35 are dried sothat a surface of the substrate 31 is exposed. Further, when a rinsingprocess is performed by using pure water 36 before the organic solvent32 is supplied, an area 37 in which the pure water 36 is dried isgenerated between the organic solvent 32 diffused on the substrate 31and the pure water 36 that is preliminarily supplied, by humid heatbetween the organic solvent 32 and the substrate 31 and a differencebetween the surface tensions of the pure water 36 and the organicsolvent 32. As the surface of the substrate 31 is exposed by the dryingphenomenon, the surface of the substrate 31 may be contaminated byparticles or a leaning phenomenon may occur in a pattern of thesubstrate 31.

SUMMARY

The inventive concept provides an apparatus and a method for minimizinga drying area generation time of a substrate when a liquid is supplied.

The inventive concept also provides an apparatus and a method forpreventing contamination of a substrate due to particles.

The inventive concept also provides an apparatus and a method forpreventing a leaning phenomenon of a substrate.

The problems that are to be solved by the inventive concept are notlimited to the above-mentioned problems, and the unmentioned problemswill be clearly understood by those skilled in the art to which theinventive concept pertains from the specification and the accompanyingdrawings.

The inventive concept provides a method for treating a substrate. In amethod for treating a substrate, the substrate may be treated bysupplying a treatment liquid onto the rotating substrate by using afirst nozzle and a second nozzle, the first nozzle may supply thetreatment liquid to an area including a central area on the substrate,and the second nozzle may supply the treatment liquid to a peripheralarea of the substrate.

The method includes a first supply operation of supplying the treatmentliquid onto the substrate by using the first nozzle and supplying thetreatment liquid to the peripheral area by using the second nozzle atthe same time, and thereafter, a second supply operation of supplyingthe treatment liquid by using the first nozzle and stopping supply ofthe treatment liquid by using the second nozzle.

In the first supply operation, the first nozzle may supply the treatmentliquid while moving a first supply point that is a supply point of thetreatment liquid supplied from the first nozzle on the substrate.

In the first supply operation, the second nozzle may supply thetreatment liquid such that a second supply point that is a supply pointof the treatment liquid supplied from the second nozzle on the substrateis fixed to a first location of the peripheral area.

In the first supply operation, the first nozzle may supply the treatmentliquid while the first supply point moves between the central area andthe peripheral area of the substrate.

The first supply operation may be performed while the treatment liquidis supplied while the first supply point moves from the center of thesubstrate to the first location once.

In the second supply operation, immediately after the first supplyoperation is performed, the first nozzle may supply the treatment liquidwhile the first supply point moves from the first location to an end ofthe substrate.

The first supply operation may be performed while the first supply pointmoves from the central area to the peripheral area once.

The first supply operation may be performed while the first supply pointreciprocates between the central area and the peripheral area once.

Unlike this, in the first supply operation, the second nozzle may supplythe treatment liquid while a second supply point that is a supply pointof the treatment liquid supplied from the second nozzle on the substratemoves between the second location and the third location of theperipheral area, and. the second location may be a location that iscloser to the central area of the substrate than the third location.

In the first supply operation, the first nozzle may supply the treatmentliquid while the first supply point moves between the central area andthe peripheral area of the substrate.

The first supply operation may be performed while the first supply pointmoves from the central area to the peripheral area once.

The first supply operation may be performed while the first supply pointreciprocates between the central area and the peripheral area once.

In the second supply operation, the first nozzle may discharge thetreatment liquid while the first supply point is fixed to the centralarea after the treatment liquid is supplied while the first supply pointis moved.

The method may further include, before the first supply operation, apre-wet operation of supplying a pre-wet liquid onto the substrate.

The pre-wet liquid may be pure water (DIW).

In the first supply operation and the second supply operation, thesubstrate may be rotated at 200 to 800 rpms.

In the first supply operation and the second supply operation, a timeperiod for which the first supply point moves from the central area tothe peripheral area once and a time period for which the first supplypoint moves from the peripheral area to the central area once may be 1.0to 1.2 seconds.

The treatment liquid may be an organic solvent including isopropylalcohol (IPA).

The substrate may be a wafer having a diameter of 300 mm, and the firstlocation may be a location that is spaced apart from the center of thewafer by 140 mm.

The inventive concept provides an apparatus for treating a substrate. Anapparatus for treating a substrate includes a housing that provides aspace for performing a substrate treating process therein, a supportunit that supports the substrate within the housing and rotates thesubstrate, a first nozzle that supplies a treatment liquid to an areaincluding a central area on the substrate positioned on the supportunit, a second nozzle that supplies a treatment liquid to a peripheralarea on the substrate positioned on the support unit, and a controllerthat controls the first nozzle and the second nozzle.

The controller may control the first nozzle and the second nozzle suchthat a first supply operation of supplying the treatment liquid onto thesubstrate by using the first nozzle and supplying the treatment liquidto the peripheral area by using the second nozzle at the same time, anda second supply operation of, thereafter, supplying the treatment liquidby using the first nozzle and stopping supply of the treatment liquid byusing the second nozzle are sequentially performed.

In the first supply operation, the controller may control the firstnozzle such that the treatment liquid is supplied while a first supplypoint that is a supply point of the treatment liquid supplied from thefirst nozzle on the substrate is moved.

In the first supply operation, the controller may control the secondnozzle such that a second supply point that is a supply point of thetreatment liquid supplied from the second nozzle on the substrate isfixed to a first location of the peripheral area.

In the first supply operation may be performed while the treatmentliquid is supplied while the first supply point moves from the center ofthe substrate to the first location once.

The controller may control the first nozzle such that in the secondsupply operation, immediately after the first supply operation isperformed, the treatment liquid is supplied while the first supply pointmoves from the first location to an end of the substrate.

The first supply operation may be performed while the first supply pointmoves from the central area to the peripheral area once.

In the first supply operation, the controller may control the secondnozzle such that a second supply point that is a supply point of thetreatment liquid supplied from the second nozzle on the substrate movesbetween the second location and the third location of the peripheralarea, and the second location may be a location that is closer to thecentral area of the substrate than the third location.

The treatment liquid may be an organic solvent.

BRIEF DESCRIPTION OF THE FIGURES

The above and other objects and features will become apparent from thefollowing description with reference to the following figures, whereinlike reference numerals refer to like parts throughout the variousfigures unless otherwise specified, and wherein:

FIG. 1 is a view illustrating a supporting unit that supports asubstrate and a liquid supply unit that supplies a liquid of a generalsubstrate treating apparatus;

FIG. 2 is a view illustrating the substrate of FIG. 1, to which theliquid is supplied, when viewed from the top;

FIG. 3 is a plan view schematically illustrating a substrate treatingsystem 1 according to the inventive concept;

FIG. 4 is a sectional view illustrating an example of the substratetreating apparatus 300;

FIG. 5 is a flowchart illustrating a method for treating a substrateaccording to an embodiment of the inventive concept;

FIGS. 6 to 10 are views sequentially illustrating the method fortreating a substrate according to an embodiment;

FIG. 11 is a view illustrating a first supply operation according toanother embodiment; and

FIGS. 12 and 13 are views illustrating a first supply operationaccording to other embodiments respectively.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the inventive concept will bedescribed in more detail with reference to the accompanying drawings.The embodiments of the inventive concept may be modified in variousforms, and the scope of the inventive concept should not be construed tobe limited to the following embodiments. The embodiments of theinventive concept are provided to describe the inventive concept forthose skilled in the art more completely. Accordingly, the shapes of thecomponents of the drawings are exaggerated to emphasize clearerdescription thereof.

In an embodiment of the inventive concept, a substrate treatingapparatus for performing a process of cleaning a substrate will bedescribed. However, the inventive concept is not limited thereto, butmay be applied to various types of apparatuses that apply a liquid ontoa substrate.

Hereinafter, examples of the apparatus and the method of the inventiveconcept will be described in detail with reference to the accompanyingdrawings.

FIG. 3 is a plan view schematically illustrating a substrate treatingsystem 1 according to the inventive concept. Referring to FIG. 3, thesubstrate treating system 1 has an index module 10 and a processtreating module 20, and the index module 10 has a plurality of loadports 120 and a feeding frame 140. The load ports 120, the feeding frame140, and the process treating module 20 may be sequentially arranged ina row. Hereinafter, a direction in which the load port 120, the feedingframe 140, and the process treating module 20 will be referred to afirst direction 12. A direction perpendicular to the first direction 12when viewed from the top will be referred to as a second direction 14,and a direction normal to a plane including the first direction 12 andthe second direction 14 will be referred to as a third direction 16.

A carrier 18, in which a substrate W is received, is seated on the loadport 120. A plurality of load ports 120 are provided, and are arrangedalong the second direction 14 in a row. FIG. 1 illustrates that fourload ports 120 are provided. The number of the load ports 120 may beincreased or decreased according to the process efficiency of theprocess treating module 20, a footprint condition, and the like. Aplurality of slots (not illustrated) provided to support peripheries ofsubstrates W are formed in the carrier 18. A plurality of slots areprovided along the third direction 16, and the substrate W is situatedin the carrier 130 such that the substrates W are stacked to be spacedapart from each other along the third direction 16. A front openingunified pod (FOUP) may be used as the carrier 18.

The process treating module 20 includes a buffer unit 220, a feedingchamber 240, and a plurality of process chambers 260. The feedingchamber 240 is arranged such that the lengthwise direction thereof is inparallel to the first direction 12. The process chambers 260 arearranged on opposite sides of the feeding chamber 240 along the seconddirection 14. The process chambers 260 situated on one side of thefeeding chamber 240 and the process chambers 260 situated on an oppositeside of the feeding chamber 240 are symmetrical to each other withrespect to the feeding chamber 240. Some of the process chambers 260 arearranged along the lengthwise direction of the feeding chamber 240.Furthermore, some of the process chambers 260 are arranged to be stackedon each other. That is, the process chambers 260 having an array of A byB (A and B are natural numbers) may be arranged on one side of thefeeding chamber 240. Here, A is the number of the process chambers 260provided in a row along the first direction 12, and B is the number ofthe process chambers 260 provided in a row along the third direction 16.When four or six process chambers 260 are provided on one side of thefeeding chamber 240, the process chambers 260 may be arranged in anarray of 2 by 2 or 3 by 2. The number of the process chambers 260 mayincrease or decrease. Unlike the above-mentioned description, theprocess chambers 260 may be provided only on one side of the feedingchamber 240. Further, unlike the above-mentioned description, theprocess chambers 260 may be provided on one side or opposite sides ofthe feeding chamber 240 to form a single layer.

A buffer unit 220 is arranged between the feeding frame 140 and thefeeding chamber 240. The buffer unit 220 provides a space in which thesubstrates W stay before being transported, between the feeding chamber240 and the feeding frame 140. Slots (not illustrated) in which thesubstrates W are positioned are provided in the buffer unit 220, and aplurality of slots (not illustrated) are provided to be spaced apartfrom each other along the third direction 16. Faces of the buffer unit220 that face the feeding frame 140 and face the feeding chamber 240 areopened.

The feeding frame 140 transports the substrates W between the carrier 18seated on the load port 120 and the buffer unit 220. An index rail 142and an index robot 144 are provided in the feeding frame 140. The indexrail 142 is arranged such that the lengthwise direction thereof is inparallel to the second direction 14. The index robot 144 is installed onthe index rail 142, and is linearly moved in the second direction 14along the index rail 142. The index robot 144 has a base 144 a, a body144 b, and a plurality of index arms 144 c. The base 144 a is installedto be moved along the index rail 142. The body 144 b is coupled to thebase 144 a. The body 144 b is provided to be moved along the thirddirection 16 on the base 144 a. The body 144 b is provided to be rotatedon the base 144 a. The index arms 144 c are coupled to the body 144 b,and are provided to be moved forwards and rearwards with respect to thebody 144 b. A plurality of index arms 144 c are provided to be drivenindividually. The index arms 144 c are arranged to be stacked so as tobe spaced apart from each other along the third direction 16. Some ofthe index arms 144 c are used when the substrates W are transported tothe carrier 18 from the process treating module 20, and some of theindex arms 144 c may be used when the substrates W are transported fromthe carrier 18 to the process treating module 20. This structure mayprevent particles generated from the substrates W before the processtreatment from being attached to the substrates W after the processtreatment in the process of carrying the substrates W in and out by theindex robot 144.

The feeding chamber 240 transports the substrates W between the bufferunit 220 and the process chambers 260, and between the process chambers260. A guide rail 242 and a main robot 244 are provided in the feedingchamber 240. The guide rail 242 is arranged such that the lengthwisedirection thereof is in parallel to the first direction 12. The mainrobot 244 is installed on the guide rail 242, and is linearly movedalong the first direction 12 on the index rail 242. The main robot 244has a base 244 a, a body 244 b, and a plurality of main arms 244 c. Thebase 244 a is installed to be moved along the guide rail 242. The body244 b is coupled to the base 244 a. The body 244 b is provided to bemoved along the third direction 16 on the base 244 a. The body 244 b isprovided to be rotated on the base 244 a. The main arms 244 c arecoupled to the body 244 b, and are provided to be moved forwards andrearwards with respect to the body 244 b. A plurality of main arms 244 care provided to be driven individually. The main arms 244 c are arrangedto be stacked so as to be spaced apart from each other along the thirddirection 16. The main arms 244 c used when the substrates W aretransported from the buffer unit 220 to the process chambers 260 and themain arms 244 c used when the substrates W are transported from theprocess chambers 260 to the buffer unit 220 may be different.

Substrate treating apparatuses 300 that perform cleaning processes onthe substrates W are provided in the process chambers 260. The substratetreating apparatuses 300 provided in the respective process chambers 260may have different structures according to the types of performedcleaning processes. Selectively, the substrate treating apparatuses 300in the respective process chambers 260 may have the same structure.Selectively, the process chambers 260 may be classified into a pluralityof groups such that the substrate treating apparatuses 300 provided inthe process chambers 260 pertaining to the same group have the samestructure and the substrate treating apparatuses 300 provided in theprocess chambers 260 pertaining to different groups have differentstructures from each other. For example, when the process chambers 260are classified into two groups, the first group of process chambers 260may be provided on one side of the feeding chamber 240 and the secondgroup of process chambers 260 may be provided on an opposite side of thefeeding chamber 240. Selectively, the first group of process chambers260 may be provided on the lower side of the feeding chamber 240 and thesecond group of process chambers 260 may be provided on the upper sideof the feeding chamber 240, on opposite sides of the feeding chamber240. The first group of process chambers 260 and the second group ofprocess chambers 260 may be classified according to the kinds of theused chemicals or the types of cleaning methods.

Hereinafter, an example of a substrate treating apparatus 300 thatcleans a substrate W by using a treatment liquid will be described. FIG.4 is a sectional view illustrating an example of the substrate treatingapparatus 300. Referring to FIG. 4, the substrate treating apparatus 300includes a housing 320, a support unit 340, an elevation unit 360, afirst supply unit 380, a second supply unit 390, and a controller 400.

The housing 320 has a space for performing a substrate treating processin the interior thereof, and an upper side of the housing 320 is opened.The housing 320 has an inner recovery vessel 322, an intermediaterecovery vessel 324, and an outer recovery vessel 326. The respectiverecovery vessels 322, 324, and 326 recover different treatment liquidsused in the process. The inner recovery vessel 322 has an annular ringshape that surrounds the support unit 340, the intermediate recoveryvessel 324 has an annular ring shape that surrounds the inner recoveryvessel 322, and the outer recovery vessel has an annular ring shape thatsurrounds the intermediate recovery vessel 324. An inner space 322 a ofthe inner recovery vessel 322, a space 324 a between the inner recoveryvessel 322 and the intermediate recovery vessel 324, and a space 326 abetween the intermediate recovery vessel 324 and the outer recoveryvessel 326 function as inlets through which the treatment liquids areintroduced into the inner recovery vessel 322, the intermediate recoveryvessel 324, and the outer recovery vessel 326 respectively. Recoverylines 322 b, 324 b, and 326 b extending from the recovery vessels 322,324, and 326 perpendicularly in the downward direction of the bottomsurfaces thereof are connected to the recovery vessels 322, 324, and326, respectively. The recovery lines 322 b, 324 b, and 326 b dischargethe treatment liquids introduced through the recovery vessels 322, 324,326, respectively. The discharged treatment liquids may be reusedthrough an external treatment liquid recycling system (not illustrated).

The support unit 340 is arranged in the housing 320. The support unit340 supports the substrate W. The support unit 340 may be provided asthe spin head 340 that rotates the supported substrate W. According toan embodiment, the spin head 340 is arranged within the housing 320. Thespin head 340 supports and rotates the substrate W during the process.The spin head 340 has a body 342, a plurality of support pins 334, aplurality of chuck pins 346, and a support shaft 348. The body 342 hasan upper surface having a substantially circular shape when viewed fromthe top. The support shaft 348 that may be rotated by a motor 349 isfixedly coupled to the bottom of the body 342. A plurality of supportpins 334 are provided. The support pins 334 may be arranged to be spacedapart from each other at a periphery of the upper surface of the body342 and protrude upwards from the body 342. The support pins 334 arearranged to have a generally annular ring shape through combinationthereof. The support pins 334 support a periphery of a rear surface ofthe substrate W such that the substrate W is spaced apart from the uppersurface of the body 342 by a predetermined distance. A plurality ofchuck pins 346 are provided. The chuck pins 346 are arranged to be moredistant from the center of the body 342 than the support pins 334. Thechuck pins 346 are provided to protrude upwards from the body 342. Thechuck pins 346 support a side of the substrate W such that the substrateW is not separated laterally from a proper place when the spin head 340is rotated. The chuck pins 346 are provided to be linearly moved betweena standby position and a support position along a radial direction ofthe body 342. The standby position is a position that is more distantfrom the center of the body 342 than the support position. When thesubstrate W is loaded on or unloaded from the spin head 340, the chuckpins 346 are located at the standby position, and when a process isperformed on the substrate W, the chuck pins 346 are located at thesupport position. The chuck pins 346 are in contact with the side of thesubstrate W at the support position.

The elevation unit 360 linearly moves the housing 320 upwards anddownwards. When the housing 320 moves upwards and downwards, a relativeheight of the housing 320 to the spin head 340 is changed. The elevationunit 360 has a bracket 362, a movable shaft 364, and a driver 366. Thebracket 362 is fixedly installed on an outer wall of the housing 320,and the movable shaft 364 that moves upwards and downwards by the driver366 is fixedly coupled to the bracket 362. The housing 320 is loweredsuch that, when the substrate W is positioned on the spin head 340 or islifted from the spin head 340, the housing 320 is lowered such that thespin head 340 protrudes to the upper side of the housing 320. When theprocess is performed, the height of the housing 320 is adjusted suchthat the treatment liquid are introduced into the preset recovery vessel360 according to the kind of the treatment liquid supplied to thesubstrate W. For example, the substrate W is located at a heightcorresponding to an interior space 322 a of the inner recovery vessel322 while the substrate W is treated by a first treatment fluid.Further, the substrate W may be located at a height corresponding to aspace 324 a between the inner recovery vessel 322 and the intermediaterecovery vessel 324 and a space 326 a between the intermediate recoveryvessel 324 and the outer recovery vessel 326 while the substrate W istreated by a second treatment liquid and a third treatment liquidrespectively. Unlike those described above, the elevation unit 360 maymove the spin head 340, instead of the housing 320, upwards anddownwards.

The first supply unit 380 has a first nozzle 384 that supplies atreatment liquid onto the substrate W positioned on the spin head 340.For example, the first supply unit 380 has a nozzle support 382, a firstnozzle 384, a support shaft 386, and a driver 388.

The lengthwise direction of the support shaft 386 is provided along thethird direction 16, and the driver 388 is coupled to a lower end of thesupport shaft 386. The driver 388 rotates and elevates the support shaft386. The nozzle support 382 is coupled to an end of the support shaft386, which is opposite to an end of the support shaft 386 coupled to thedriver 388, perpendicularly to the support shaft 386. The first nozzle384 is installed on a bottom surface of an end of the nozzle support382. The first nozzle 384 moves to a process location and a standbylocation by the driver 388. The process location is a location at whichthe first nozzle 384 is arranged at a vertical upper portion of thehousing 320, and the standby location is a location that deviates fromthe vertical upper portion of the housing 320.

The first nozzle 384 supplies a treatment liquid to an area including acentral area on the substrate W positioned on the spin head 340. Astorage container 371 that stores the treatment liquid is connected tothe first nozzle 384 through a supply line. A valve 372 is installed inthe supply line.

The second supply unit 390 has a second nozzle 394 that supplies atreatment liquid onto the substrate W positioned on the spin head 340.The second nozzle 394 supplies a treatment liquid to a peripheral areaof the substrate W positioned on the spin head 340. A storage container371 that stores the treatment liquid is connected to the second nozzle394 through a supply line. A valve 373 is installed in the supply line.The second supply unit 390 has a driver 398 to change a treatment liquidsupply point of the second nozzle 394. The other configurations andstructures of the second supply unit 390 are similar to those of thefirst supply unit 380. The treatment liquids supplied through the firstnozzle 384 and the second nozzle 394 may be the same. The treatmentliquid may be an organic solvent such as isopropyl alcohol (IPA).

The controller 400 controls the valves 372 and 373 connectedrespectively to the first nozzle 384 and the second nozzle 394 and thedrivers 388 and 398 to determine whether the liquid is dischargedthrough the first nozzle 384 and the second nozzle 394 and adjust thesupply points of the first nozzle 384 and the second nozzle 394 on thesubstrate W. Hereinafter, a method for treating the substrate W bycontrolling the first nozzle 384 and the second nozzle 394 by thecontroller 400 to supply the treatment liquid to the substrate Wsupported by the spin head 340 will be described in detail.

Hereinafter, the method for treating a substrate according to theembodiment of the inventive concept by using the above-mentionedsubstrate treating apparatus will be described for convenience ofdescription.

FIG. 5 is a flowchart illustrating a method for treating a substrateaccording to an embodiment of the inventive concept. Referring to FIGS.4 and 5, the treatment liquid is supplied onto a rotating substrate byusing the first nozzle 384 and the second nozzle 394 to treat thesubstrate. The substrate treating method includes a pre-wet operationS110, a first supply operation S120, and a second supply operation S130.According to an embodiment, the controller 400 controls the valves 372and 373 and the drivers 388 and 398 to sequentially perform the firstsupply operation S120 and the second supply operation S130.

The pre-wet operation S110 is selectively performed if necessary beforethe first supply operation S120. In the pre-wet operation S110, apre-wet liquid is supplied onto the substrate W positioned on the spinhead 340. According to an embodiment, the pre-wet liquid may be purewater (DIW). Optionally, the pre-wet operation S110 may not beperformed.

FIGS. 6 to 10 are views sequentially illustrating the method fortreating a substrate according to an embodiment.

FIG. 6 is a view illustrating that the first nozzle 384 and the secondnozzle 394 move to perform the first supply operation S120. Referring toFIG. 6, in a preparation operation, the controller 400 controls thedrivers 388 and 398 such that the first nozzle 384 and the second nozzle394 are located to initial locations at which the treatment liquid maybe supplied onto the substrate. For example, the controller 400 controlsthe drivers 388 and 398 such that the first nozzle 384 is located at alocation at which the treatment liquid may be discharged to a centralarea of the substrate W and the second nozzle 394 is located at alocation at which the treatment liquid may be discharged to a peripheralarea of the substrate W.

FIG. 7 is a view illustrating a first supply operation S120. Referringto FIG. 7, in the first supply operation S120, the treatment liquid issupplied to the substrate W positioned on the spin head 340 by using thefirst nozzle 384, and the treatment liquid is supplied to the substrateW positioned on the spin head 340 by using the second nozzle 394 at thesame time. According to an embodiment, the controller 400 controls thevalve 372 and the driver 388 such that a first supply point that is asupply point of the treatment liquid supplied from the first nozzle 384on the substrate moves between the central area and the peripheral areaof the substrate W to be supplied with the treatment liquid during thefirst supply operation S120. For example, as illustrated in FIG. 7, thefirst supply operation S120 is performed while the treatment liquid issupplied while the first supply point moves from the center of thesubstrate W to a first location 41 once as the first nozzle 384controlled by the controller 400 moves. At the same time, the controller400 controls the driver 398 such that a second supply point that is asupply point of the treatment liquid supplied from the second nozzle 394is fixed to the first location 41 of the peripheral area of thesubstrate W during the first supply operation S120. The substrate W maybe a wafer having a radius of 300 mm, and the first location 41 may be alocation that is spaced apart from the center of the wafer by 140 mm.

FIGS. 8 to 10 are views sequentially illustrating a second supplyoperation S130.

In the second supply operation S130, the first nozzle 384 supplies thetreatment liquid and the second nozzle 394 stops supplying the treatmentliquid. Referring to FIG. 8, the controller 400 controls the valve 372and the driver 388 such that the first nozzle 384 supplies the treatmentliquid while moving the first supply point. For example, the controller400 controls the valve 372 and the driver 388 such that, after thetreatment liquid is supplied while the first supply point moves from thefirst location 41 that is a final location in the first supply operationS120 to an end of the substrate W, the treatment liquid is suppliedwhile the first supply point moves to the center of the substrate W.

Referring to FIG. 9, thereafter, the controller 400 controls the valve372 and the driver 388 such that the first supply point moves betweenthe peripheral area of the substrate W and the central area of thesubstrate W several times. For example, the controller 400 controls thevalve 372 and the driver 388 such that the first supply point movesbetween an end of the substrate W and the center of the substrate Wseveral times.

Referring to FIG. 10, thereafter, the controller 400 controls the valve372 and the driver 388 such that the treatment liquid may be suppliedwhile the first supply point is fixed to the central area of thesubstrate W. For example, in this case, the first supply point may bethe center of the substrate W.

Although FIGS. 8 to 10 illustrates a state in which the second supplypoint of the second nozzle 394 is fixed to the first location during thesecond supply operation S130 in which the second nozzle 394 does notdischarge the treatment liquid, optionally, the second nozzle 394 may belocated to deviate from a location that faces the substrate W supportedby the spin head 340 when viewed from the top during the second supplyoperation S130.

During the first supply operation S120 and the second supply operationS130, the substrate W supported by the spin head 340 may be rotated at100 to 800 rpms. In this case, a time period for which the first supplypoint and the second supply point move from the central area of thesubstrate W to the peripheral area of the substrate W once and a timeperiod for which the first supply point and the second supply point movefrom the peripheral area of the substrate W to the central area of thesubstrate W once may be 1.0 to 1.2 seconds. The rotational speed of thesubstrate W and the movement speed of the first supply point may be setdifferently from the above-description. When the rotational speed of thesubstrate W is less than 100 rpms, the movement time of the substrate Wmay be set to less than 1.0 seconds. Further, when the rotational speedof the substrate W exceeds 800 rpms, the movement time of the substrateW may be set to more than 1.2 seconds.

FIG. 11 is a view illustrating a first supply operation S120 accordingto another embodiment. Referring to FIG. 11, unlike FIG. 7, during thefirst supply operation S120, optionally, the controller 400 controls thevalve 373 and the driver 398 such that the treatment liquid may besupplied while the second supply point moves between the second location42 and the third location 43 of the peripheral area of the substrate W.The second location 42 is a location that is closer to the central areaof the substrate W than the third location 43. For example, the secondlocation 42 is a location that is closer to the central area of thesubstrate W than the first location 41, and the third location 43 is alocation that is closer to an end of the substrate W than the firstlocation 41.

FIGS. 12 and 13 are views illustrating a first supply operation S120according to other embodiments respectively.

Referring to FIG. 12, unlike FIG. 7, the first supply operation S120 isperformed while the first supply point moves from the central area ofthe substrate W to the peripheral area of the substrate W once. Forexample, the controller 400 controls the valve 372 and the driver 388such that the treatment liquid may be supplied while the first supplypoint moves between the center of the substrate W and an end of thesubstrate W once during the first supply operation S120. Thereafter, thesecond supply operation S130 is performed as in FIGS. 9 and 10.

Referring to FIG. 13, unlike FIGS. 7 and 12, the first supply operationis performed while the first supply point reciprocates between thecentral area of the substrate W and the peripheral area of the substrateW once. For example, the controller 400 controls the valve 372 and thedriver 388 such that the treatment liquid may be supplied while thefirst supply point reciprocates between the center of the substrate Wand an end of the substrate W once during the first supply operationS120. Thereafter, the second supply operation S130 is performed as inFIGS. 9 and 10.

Unlike FIGS. 7, 12, and 13, the movement of the first supply point inthe first supply operation S120 allows the treatment liquid to besupplied while the first supply point moves between various locationsand/or various numbers of times.

As mentioned above, the inventive concept may prevent contamination ofthe substrate due to particles and a leaning phenomenon due to thesubstrate drying phenomenon by providing the second nozzle 394 thatdischarges the treatment liquid to the peripheral area of the substratein addition to the first nozzle 384 to shorten a time period for whichthe treatment liquid is applied to the whole substrate W when the liquidis supplied and minimize a time for generation of the drying area of thesubstrate.

According to the embodiments of the inventive concept, a time forgeneration of a drying area of the substrate may be minimized when theliquid is supplied.

Further, according to the embodiments of the inventive concept,contamination of the substrate due to particles may be prevented.

Further, according to the embodiments of the inventive concept, leaningof the substrate due to particles may be prevented.

What is claimed is:
 1. A method for treating a substrate, wherein thesubstrate is treated by supplying a treatment liquid onto the rotatingsubstrate by using a first nozzle and a second nozzle, wherein the firstnozzle supplies the treatment liquid to an area including a central areaon the substrate, and wherein the second nozzle supplies the treatmentliquid to a peripheral area of the substrate.
 2. The method of claim 1,comprising: a first supply operation of supplying the treatment liquidonto the substrate by using the first nozzle and supplying the treatmentliquid to the peripheral area by using the second nozzle at the sametime; and thereafter, a second supply operation of supplying thetreatment liquid by using the first nozzle and stopping supply of thetreatment liquid by using the second nozzle.
 3. The method of claim 2,wherein in the first supply operation, the first nozzle supplies thetreatment liquid while moving a first supply point that is a supplypoint of the treatment liquid supplied from the first nozzle on thesubstrate.
 4. The method of claim 3, wherein in first supply operation,the second nozzle supplies the treatment liquid such that a secondsupply point that is a supply point of the treatment liquid suppliedfrom the second nozzle on the substrate is fixed to a first location ofthe peripheral area.
 5. The method of claim 4, wherein in the firstsupply operation, the first nozzle supplies the treatment liquid whilethe first supply point moves between the central area and the peripheralarea of the substrate.
 6. The method of claim 4, wherein the firstsupply operation is performed while the treatment liquid is suppliedwhile the first supply point moves from the center of the substrate tothe first location once.
 7. The method of claim 6, wherein in the secondsupply operation, immediately after the first supply operation isperformed, the first nozzle supplies the treatment liquid while thefirst supply point moves from the first location to an end of thesubstrate.
 8. The method of claim 5, wherein the first supply operationis performed while the first supply point moves from the central area tothe peripheral area once.
 9. The method of claim 5, wherein the firstsupply operation is performed while the first supply point reciprocatesbetween the central area and the peripheral area once.
 10. The method ofclaim 3, wherein in the first supply operation, the second nozzlesupplies the treatment liquid while a second supply point that is asupply point of the treatment liquid supplied from the second nozzle onthe substrate moves between the second location and the third locationof the peripheral area, and. wherein the second location is a locationthat is closer to the central area of the substrate than the thirdlocation.
 11. The method of claim 10, wherein in the first supplyoperation, the first nozzle supplies the treatment liquid while thefirst supply point moves between the central area and the peripheralarea of the substrate.
 12. The method of claim 11, wherein the firstsupply operation is performed while the first supply point moves fromthe central area to the peripheral area once.
 13. The method of claim11, wherein the first supply operation is performed while the firstsupply point reciprocates between the central area and the peripheralarea once.
 14. The method of claim 4, wherein in the second supplyoperation, the first nozzle discharges the treatment liquid while thefirst supply point is fixed to the central area after the treatmentliquid is supplied while the first supply point is moved.
 15. The methodof claim 14, further comprising: before the first supply operation, apre-wet operation of supplying a pre-wet liquid onto the substrate. 16.The method of claim 14, wherein the pre-wet liquid is pure water (DIW).17. The method of claim 1, wherein in the first supply operation and thesecond supply operation, the substrate is rotated at 200 to 800 rpms.18. The method of claim 5, wherein in the first supply operation and thesecond supply operation, a time period for which the first supply pointmoves from the central area to the peripheral area once and a timeperiod for which the first supply point moves from the peripheral areato the central area once are 1.0 to 1.2 seconds.
 19. The method of claim1, wherein the treatment liquid is an organic solvent.
 20. The method ofclaim 19, wherein the organic solvent includes isopropyl alcohol (IPA).21. The method of claim 4, wherein the substrate is a wafer having adiameter of 300 mm, and wherein the first location is a location that isspaced apart from the center of the wafer by 140 mm.